ISSN 2594-5327
59º Congresso anual — Vol. 59 , num. 1 (2004)
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Resumo
The adhesion between thin metal films and metal substrates is a major technological concern and a number of analytical and experimental investigations on this topic have been reported. When a thin coating is bonded to the surface of a substrate, displacements produce stress and strains at the coating. Only in a few instance the strains at the coating-substrate interface are transmitted to the coating without some modification or distortion. In the present work, a three-dimensional beam analysis will be used to investigate the effect of coating thickness and residual stress state on coating bond strength. Thus the thickness effects will be treated here by a simple model, that’s, a specimen in pure bending. A detailed study on the equations is discussed and the theoretical results are presented in graphical form.
The adhesion between thin metal films and metal substrates is a major technological concern and a number of analytical and experimental investigations on this topic have been reported. When a thin coating is bonded to the surface of a substrate, displacements produce stress and strains at the coating. Only in a few instance the strains at the coating-substrate interface are transmitted to the coating without some modification or distortion. In the present work, a three-dimensional beam analysis will be used to investigate the effect of coating thickness and residual stress state on coating bond strength. Thus the thickness effects will be treated here by a simple model, that’s, a specimen in pure bending. A detailed study on the equations is discussed and the theoretical results are presented in graphical form.
Palavras-chave
coating thickness effect, coating-substrate specimen, analytical method.
coating thickness effect, coating-substrate specimen, analytical method.
Como citar
Dias, José Celio.
EQUATIONS TO ANALYSIS OF THE COATING THICKNESS ON THE STRESS DISTRIBUTION IN A COATING-SUBSTRATE SPECIMEN,
p. 397-406.
In: 59º Congresso anual,
São Paulo, Brasil,
2004.
ISSN: 2594-5327, DOI 10.5151/2594-5327-3642
