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Congresso Anual da ABM


ISSN 2594-5327

49º Congresso anual Vol. 49, Num. 1 (1994)


Título

Microstructural Characteristics of an Aluminium Metal Matrix Composite

Autoria

DOI

10.5151/2594-5327-49v9-313-326

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Resumo

Since composite materials were developed, a significant amount of work have been done on the processing of materials. One critical issue, in the processing of composites materials with an aluminium matrix is the incorporation of SiCp or carbon fibre to the molten metal, since the reinforcement materials are not wetted by the liquid metal; it is of great interest to determine the degree of interfacial bonding. The research reported in this paper was carried out with the aim to study how the processing variables, of the compocasting process, such as shear rate (γ = 27,120 and 219 s⁻¹) and solid fraction (fs = 0.3, 0.4 and 0.5) influence the mechanical entrapment of SiCp in an aluminium matrix. In addition, the atomic-force-microscope (AFM) was used to investigate the surface topography of Al/SiCp composite, with the purpose to determine qualitatively the degree of interfacial bonding between aluminium matrix and reinforcement elements. In addition, by using the chemical facilities of SEM the interface matrix/reinforcement was examined. The results have shown that the mechanical entrapment of the particles by the solid is more efficient at solid fractions higher than 0.4 and shear rates (γ) of 120 s⁻¹. In contrast, at fs = 0.3 and γ = 27 s⁻¹ such effect has been poor. Finally, SEM results suggested that bonding between the reinforcement and the matrix may be established through the silicon phase, however, it is considered that more accurate chemical analysis are needed.

 

Palavras-chave

aluminium matrix, SiCp, interface bonding, shear rate, solid fraction

Como citar

ManzanoRamírez, A.; MagallanesCastañeda, A.; Ruiz, F.; VazquezLopes, C.; NavaVazquez, E.. Microstructural Characteristics of an Aluminium Metal Matrix Composite, p. 4402-4415. In: 49º Congresso anual, Rio de Janeiro, Brasil, 1994.
ISSN: 2594-5327, DOI 10.5151/2594-5327-49v9-313-326