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Seminário de Aciaria, Fundição e Metalurgia de Não-ferrosos


ISSN 2594-5300

33º Seminário de Aciaria Vol. 01 , num. 33 (2002)


Título

VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“

VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“

Autoria

DOI

10.5151/2594-5300-C01787

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Resumo

VAI has developed and tested an innovative continuous temperature and analysis system for metallurgical vessels with the tradenames VAI-CON® Temp and VAI-CON® Chem. These new systems offer a potential for improved process control in steelmaking. They were tested in the laboratory and proved its functionality in industrial applications. VAI-CON® Temp offers accurate temperature measurements and VAI-CON® Chem provides the chemical analysis results for chosen elements during the entire treatment time. Both systems together replace the traditional discontinuous temperature measurement techniques and sampling.

 

VAI has developed and tested an innovative continuous temperature and analysis system for metallurgical vessels with the tradenames VAI-CON® Temp and VAI-CON® Chem. These new systems offer a potential for improved process control in steelmaking. They were tested in the laboratory and proved its functionality in industrial applications. VAI-CON® Temp offers accurate temperature measurements and VAI-CON® Chem provides the chemical analysis results for chosen elements during the entire treatment time. Both systems together replace the traditional discontinuous temperature measurement techniques and sampling.

Palavras-chave

continuous measurement, contactless measurement, steelmaking, temperature analysis, VAI-CON Chem

continuous measurement, contactless measurement, steelmaking, temperature analysis, VAI-CON Chem

Como citar

Ramaseder, Dr. N.; Steins, DI. J.; Hiebler, DI. M.; Meyer, Dr. W.; Hochörtler, DI. J.; Schwelberger, Dr. J.. VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“, p. 177-187. In: 33º Seminário de Aciaria, São Paulo, Brasil, 2002.
ISSN: 2594-5300, DOI 10.5151/2594-5300-C01787