Title

NUMERICAL MODELING OF ADHESION AND ADHESIVE FAILURE DURING THE UNIDIRECTIONAL CONTACT BETWEEN METALLIC SURFACES

Authorship

Eleir Mundim Bortoleto; Erika Fernanda Prados; Vanessa Seriacopi; Newton Kiyoshi Fukumasu; Luiz Gustavo Del Bianchi da Silva Lima; Cristiano Fernandes Lagatta; Izabel Fernanda Machado; Roberto Martins Souza

Eleir Mundim Bortoleto

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Erika Fernanda Prados

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Vanessa Seriacopi

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Newton Kiyoshi Fukumasu

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Luiz Gustavo Del Bianchi da Silva Lima

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Cristiano Fernandes Lagatta

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Izabel Fernanda Machado

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Roberto Martins Souza

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DOI

10.5151/1472-5836-25644

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Abstract

A finite element modeling approach was developed to study adhesion phenomena during the unidirectional contact between a two-dimensional plane-strain square and a flat slab. Surfaces were metallic or ceramic, different pairs of materials were analyzed and their adhesion was considered by means of a FORTRAN subroutine (DLOAD), which was connected with commercial finite element code Abaqus and provided surface attractive forces based on the Lennard-Jones interatomic potential. Adhesive loads were considered both during approximation and separation of the surfaces. During the separation step, material transfer between surfaces, due to adhesion, was modeled by means of damage initiation and propagation at the flat slab. The parameters considered in the simulations were normal load, chemical affinity and system size and the different conditions were analyzed by comparison of the interaction forces during approach and withdrawal. This work also presents detailed descriptions of: (i) the evolution of energy dissipation due to adhesion hysteresis, (ii) the formation-growth-breakage of adhesive junctions and (iii) the evolution of stress distribution during the process. Results have indicated that chemical affinity between the bodies in contact is more relevant for adhesion than the applied load. Besides, smaller asperities are less prone to promote adhesive wear, but they may be subjected to high stress concentration effects.

Keywords

Adhesion; Adhesive failure; Finite element model; Interatomic potentials