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Proceedings of the Seminar on Steelmaking, Casting and Non-Ferrous Metallurgy


ISSN 2594-5300

33º Seminário de Aciaria Vol. 01 , num. 33 (2002)


Title

VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“

VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“

Authorship

DOI

10.5151/2594-5300-C01787

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Abstract

VAI has developed and tested an innovative continuous temperature and analysis system for metallurgical vessels with the tradenames VAI-CON® Temp and VAI-CON® Chem. These new systems offer a potential for improved process control in steelmaking. They were tested in the laboratory and proved its functionality in industrial applications. VAI-CON® Temp offers accurate temperature measurements and VAI-CON® Chem provides the chemical analysis results for chosen elements during the entire treatment time. Both systems together replace the traditional discontinuous temperature measurement techniques and sampling.

 

VAI has developed and tested an innovative continuous temperature and analysis system for metallurgical vessels with the tradenames VAI-CON® Temp and VAI-CON® Chem. These new systems offer a potential for improved process control in steelmaking. They were tested in the laboratory and proved its functionality in industrial applications. VAI-CON® Temp offers accurate temperature measurements and VAI-CON® Chem provides the chemical analysis results for chosen elements during the entire treatment time. Both systems together replace the traditional discontinuous temperature measurement techniques and sampling.

Keywords

continuous measurement, contactless measurement, steelmaking, temperature analysis, VAI-CON Chem

continuous measurement, contactless measurement, steelmaking, temperature analysis, VAI-CON Chem

How to cite

Ramaseder, Dr. N.; Steins, DI. J.; Hiebler, DI. M.; Meyer, Dr. W.; Hochörtler, DI. J.; Schwelberger, Dr. J.. VAI-CON® Temp and VAI-CON® Chem – „New Dimensions in Continuous and Contactless Measurement“, p. 177-187. In: 33º Seminário de Aciaria, São Paulo, Brasil, 2002.
ISSN: 2594-5300, DOI 10.5151/2594-5300-C01787