ISSN 2594-5327
58º Congresso anual — Vol. 58 , num. 1 (2003)
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The objective of the present work is to present and discuss the delamination problem found in running the Multiuser Project (MUSA 2000 -Copper) where copper microstructures of different sizes and shapes and for various applications are electroformed together, on a same substrate, using LIGA technology. Delamination occurred when copper layers (40–50 µm) were electroformed using commercial bath on substrates having conductive thin films deposited on thick (1 µm) thermally grown silicon oxide layers (TTGSOL). Delamination was prevented by replacing commercial bath by homemade bath or by sending samples to be electroformed in an industry. This is an exploratory work that will be useful in a further refinement work. Few nickel electroforming experiments suggest the existence of the same problems and solutions found in the copper experiments. Gold electroforming was performed to produce absorbers for X-ray masks. The hole of the polymeric mold used in the electroforming work was also evaluated. The studies of mold performance, evaluated in terms of microstructure lateral resolution and mold removal after electroforming, revealed that a new photo-polymer should be found to meet the stringent X-ray mask requirements.
The objective of the present work is to present and discuss the delamination problem found in running the Multiuser Project (MUSA 2000 -Copper) where copper microstructures of different sizes and shapes and for various applications are electroformed together, on a same substrate, using LIGA technology. Delamination occurred when copper layers (40–50 µm) were electroformed using commercial bath on substrates having conductive thin films deposited on thick (1 µm) thermally grown silicon oxide layers (TTGSOL). Delamination was prevented by replacing commercial bath by homemade bath or by sending samples to be electroformed in an industry. This is an exploratory work that will be useful in a further refinement work. Few nickel electroforming experiments suggest the existence of the same problems and solutions found in the copper experiments. Gold electroforming was performed to produce absorbers for X-ray masks. The hole of the polymeric mold used in the electroforming work was also evaluated. The studies of mold performance, evaluated in terms of microstructure lateral resolution and mold removal after electroforming, revealed that a new photo-polymer should be found to meet the stringent X-ray mask requirements.
Palavras-chave
electroforming, delamination, LIGA technology
electroforming, delamination, LIGA technology
Como citar
Maia, Izaque Alves; Ferreira, Luiz Otávio Saraiva; Piazzetta, Maria Helena de Oliveira; Natal, Graziele Capeleto; Filho, José Roberto.
LIGA TECHNOLOGY – Cu, Au AND Ni ELECTROFORMING,
p. 525-532.
In: 58º Congresso anual,
Rio de Janeiro, Brasil,
2003.
ISSN: 2594-5327, DOI 10.5151/2594-5327-2528
