ISSN 2594-5327
61º Congresso Anual da ABM — Vol. 61, Num. 61 (2006)
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Resumo
Owing to impending European legislation, lead will no longer be used in the fabrication of electrical and electronic materials within Europe. COST 531 is a European action on the study of new lead-free materials suitable for use in the electronics industry. One of the objectives of the action is the provision of a self- consistent thermodynamic database for lead-free solder materials and substrates. Assessed thermodynamic parameters for more than 50 binary systems have been collected from the literature or have been provided directly by a programme of experimental and assessment work as part of the COST action. These data have been supplimented by parameters for ternary systems to provide a self-consistent thermodynamic database. The database has been tested thoroughly using proprietry software to ensure its portabiltiy.
Owing to impending European legislation, lead will no longer be used in the fabrication of electrical and electronic materials within Europe. COST 531 is a European action on the study of new lead-free materials suitable for use in the electronics industry. One of the objectives of the action is the provision of a self- consistent thermodynamic database for lead-free solder materials and substrates. Assessed thermodynamic parameters for more than 50 binary systems have been collected from the literature or have been provided directly by a programme of experimental and assessment work as part of the COST action. These data have been supplimented by parameters for ternary systems to provide a self-consistent thermodynamic database. The database has been tested thoroughly using proprietry software to ensure its portabiltiy.
Palavras-chave
Lead-free solders; Thermodynamics; Phase diagrams.
Lead-free solders; Thermodynamics; Phase diagrams.
Como citar
Watson, Andy; Dinsdale, Alan; Kroupa, Ales; Vízdal, Jirí; Vrestal, Jan; Zemanová, Adéla.
THE COST 531 LEAD-FREE SOLDERS THERMODYNAMIC DATABASE
,
p. 1195-1205.
In: 61º Congresso Anual da ABM,
Rio de Janeiro,
2006.
ISSN: 2594-5327, DOI 10.5151/2594-5327-2005-14337-0140
